Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.

Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.

Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.

Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.

AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.

Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.