Laser Diode Submount
AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.
HTCC Hermetic Package
Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.
Thick-Film Ceramic Heater
Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
LED COB Ceramic Board
High-power chip-on-board lighting substrate — a rugged ceramic alternative to metal-core PCB.
Thin-Film RF Circuit
Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.
Si₃N₄ AMB Module Substrate
Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.
AlN DBC Power Substrate
Aluminum nitride with 0.3 mm direct-bonded copper for IGBT / SiC power modules requiring…
Alumina DPC Substrate
96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and…