Compare process choices, then confirm material, geometry, finish and inspection for your drawing.
Each route changes conductor geometry, assembly choices and inspection needs. Confirm the actual material and process combination for your drawing.
Bonded copper sheets call for a review of current path, copper layout, ceramic grade and thermal cycling.
Brazed metal-ceramic joints require the material, metal pattern and cycling conditions to be specified together.
Plated patterns warrant checks of feature size, metal thickness, vias, finish and adhesion.
Deposited layers need a defined stack, pattern geometry, attachment method and acceptance tests.
Printed conductors and resistors depend on the paste system, firing route and artwork.
Co-fired multilayer structures require compatible ceramic, conductor, cavity and shrinkage specifications.
| Design input | Ceramic | Bonded metal | Patterned metal |
|---|---|---|---|
| Grade and thickness | Provide a named grade | Check compatibility | Check preparation |
| Conductor | Describe electrical load | Specify metal on each face | Specify layer stack |
| Pattern | Show datums and edges | Check spacing and balance | Check width and registration |
| Holes and vias | Mark each function | Confirm feasibility | Confirm plating or fill |
| Assembly | State thermal conditions | Define attach surfaces | Define finish by area |
| Inspection | Set acceptance criteria | Agree metal tests | Agree feature tests |
| Process | Conductor approach | Layout question | Review focus |
|---|---|---|---|
| DBC / DCB | Bonded copper sheet | How do thickness and pattern interact? | Grade, spacing and cycling |
| AMB | Brazed metal-ceramic joint | What loading and cycle profile apply? | Interface and inspection |
| DPC | Patterned plated metal | What feature and metal stack are needed? | Registration, vias and finish |
| Thin Film | Deposited patterned layers | What layer stack meets the circuit? | Attachment and tests |
| Thick Film | Printed fired patterns | Which paste and artwork are specified? | Firing and geometry |
| HTCC / LTCC | Co-fired multilayer structure | Which ceramic and conductor system? | Shrinkage, cavities and vias |
Specify where soldering or wire bonding occurs, then confirm the finish stack and acceptance method.
Review contact, oxidation and assembly needs before selecting a finish.
Show depth, location and tolerances on the drawing; confirm whether the selected process can form them.
Define the finished edge, handling loads and acceptable chips or cracks for the part.
State required measurements and reports with conditions and acceptance criteria.
Identify solder, sinter or bond areas and ask which substrate and finish combinations are feasible.
A ceramic PCB capability is a combination of material grade, conductor process, geometry, finish and acceptance criteria. A minimum line width quoted alone does not establish whether the same build can also meet a chosen copper thickness, hole diameter or edge clearance. Use the process comparison above to prepare your requirements, then ask for a review against the controlled drawing.
Request that the review identify the proposed material and process, exceptions to the drawing, agreed inspection scope and any prototype evidence required before production. Do not combine a fine-feature limit from one process with a metal thickness or panel size from another. Confirm quantity, availability and delivery schedule with the quotation.
The design review guide explains how to prepare drawings. The RFQ checklist helps assemble the file package. Send the drawing and unresolved requirements to discuss a defined build.