Custom alumina, aluminum nitride and silicon nitride PCBs — engineered for power modules, EV inverters, high-power LED and RF. From prototype to volume, with DBC, AMB, DPC and thin-film metallization.
Explore how four ceramic families differ. Select a named grade and verify its properties and availability for your drawing.
An electrical insulator with grade-dependent thermal and mechanical properties. Check the actual formulation, thickness and assembly method.
Start with the grade datasheetAn insulating ceramic considered when substrate heat conduction matters. Assess the full stack, including attach layers and cooling.
Model the complete stackA family considered for mechanically demanding designs. Reliability depends on the grade, conductor pattern, joints and test profile.
Specify the cycle profileA specialist material requiring confirmation of supply, processing and occupational controls where dust may be generated.
Confirm feasibility and safetyMaterial conductivity alone does not predict die temperature. Check each input before comparing grades.
Share the drawing, heat load and cooling conditions to discuss a material choice. Start a review →
Each route changes conductor geometry, assembly choices and inspection needs. Confirm the actual material and process combination for your drawing.
Bonded copper sheets call for a review of current path, copper layout, ceramic grade and thermal cycling.
Brazed metal-ceramic joints require the material, metal pattern and cycling conditions to be specified together.
Plated patterns warrant checks of feature size, metal thickness, vias, finish and adhesion.
Deposited layers need a defined stack, pattern geometry, attachment method and acceptance tests.
Printed conductors and resistors depend on the paste system, firing route and artwork.
Co-fired multilayer structures require compatible ceramic, conductor, cavity and shrinkage specifications.
| Design input | Ceramic | Bonded metal | Patterned metal |
|---|---|---|---|
| Grade and thickness | Provide a named grade | Check compatibility | Check preparation |
| Conductor | Describe electrical load | Specify metal on each face | Specify layer stack |
| Pattern | Show datums and edges | Check spacing and balance | Check width and registration |
| Holes and vias | Mark each function | Confirm feasibility | Confirm plating or fill |
| Assembly | State thermal conditions | Define attach surfaces | Define finish by area |
| Inspection | Set acceptance criteria | Agree metal tests | Agree feature tests |
Explore ceramic substrate applications and the thermal, electrical and packaging requirements behind them.
IGBT / SiC inverters, OBC, DC-DC
COB, UV-C curing, automotive
Antennas, filters, LTCC modules
Diode submounts, TEC, sensors
Hermetic HTCC, headers, carriers
Imaging, sensors, packaging review
Hi-rel, wide-temp, hermetic
SMPS, motor drives, welding
Representative parts across our processes. Every product is built to your drawing.
96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and…
Aluminum nitride with 0.3 mm direct-bonded copper for IGBT / SiC power modules requiring…
Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.
Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.
High-power chip-on-board lighting substrate — a rugged ceramic alternative to metal-core PCB.
Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.
AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.
Send a Gerber file, drawing or sketch with your requirements for a design review.
We recommend the ceramic, metallization and finish for your thermal and cost target.
Agree on prototype scope, acceptance criteria and a delivery schedule before release.
Confirm production quantities, lot documentation and inspection requirements for the approved drawing.
Tell us the material, size and quantity, or attach a design file. Include your contact details so we can discuss your project.