Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
Related products
HTCC Hermetic Package
Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.
Laser Diode Submount
AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.
Si₃N₄ AMB Module Substrate
Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.
AlN DBC Power Substrate
Aluminum nitride with 0.3 mm direct-bonded copper for IGBT / SiC power modules requiring…