Representative parts across alumina, AlN and Si₃N₄ with DBC, AMB, DPC and film metallization. Every product is built to your drawing.

Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.

96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and…

High-power chip-on-board lighting substrate — a rugged ceramic alternative to metal-core PCB.

Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
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