96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and compact power.

96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and compact power.

Aluminum nitride with 0.3 mm direct-bonded copper for IGBT / SiC power modules requiring…

Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.

Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.

Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
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