Focusing on the research and development of ceramic-based circuit boards, we have a leading edge over our peers for the metallization process of various materials. At present, we have completed the delivery of products, including the types of materials are: alumina ceramic-based, aluminum nitride ceramic-based, zirconium oxide, lead oxide, silicon carbide, silicon nitride, ZAT, glass, quartz, diamond, sapphire ceramic-based and so on
DPC (Direct Plate Copper) direct copper plating: substrate metallization by using evaporation, magnetron sputtering and other processes under high temperature, high vacuum conditions, firstly, a thin film transition metal is sputtered on the surface of the substrate, and then a copper layer, and finally, it is completed through a series of circuit board processes.
RAYMING has a mature process and stable work team, can realize the board surface interconnection (hole conduction), hole filling rate and other difficult points in the industry, line width and line spacing to achieve the refinement (the minimum can be completed 50um), the completion of the copper thickness ranging from 1-1000um, according to the customer’s different requirements for the realization of customized services.
Multi-ceramic circuit board (multilayer ceramic circuit board): The traditional thick film multilayer adopts the printing and sintering method to realize the preparation of multilayer circuits, which is to make each layer of circuits separately (punching-filling-printing), and then realizes the one-piece molding of the circuit substrate through the stacking-laminating-co-firing method, and is unable to realize the circuits of too many layers. Fortune Tiansheng adopts an advanced process to sputter a ceramic film layer as a dielectric layer on a ceramic circuit board that has already been metallized, and then completes the second layer of circuits on the generated ceramic layer with metal graphics. Compared with the traditional process, this method can realize more precise graphic production, which is suitable for high wiring, high capacity, high-level chip production, so that the final product achieves the characteristics of fine density and thinness.
Laser Print Metallization Technology (Print Metallization Technoloy) The technology is the National Optoelectronics Laboratory’s excellent R & D team combined with new materials and cutting-edge high-tech products, through laser processing and new solder technology can be printed on a variety of substrate graphics. The technology is suitable for complex structural components, the real meaning of the realization of three-dimensional line layout. Samples have already been completed in the laboratory and mass production trials are in full swing.
Laser etching technology (Lase etching) traditional circuit boards in the production of graphics need to resist plating (dry film / ink) fade out, resulting in environmental pollution and waste, the technology through the form of laser processing directly on the substrate has been completed metallization of the shape of the line other than the bare, saving the process flow and materials, suitable for some specific products.
Laser perforation/cutting: the working machine is equipped with international first-class brand fiber laser, optical path optimization makes the laser spot focusing less than 50um, perforation minimum aperture can be up to 0.06mm, the minimum board thickness of 0.1mm. external processing can be carried out with high precision any shape of the scribing, semi-cutting, cutting, and other solutions to meet the customer’s requirements.