Custom alumina, aluminum nitride and silicon nitride PCBs — engineered for power modules, EV inverters, high-power LED and RF. From prototype to volume, with DBC, AMB, DPC and thin-film metallization.
Each ceramic trades thermal conductivity, mechanical strength and cost differently. Here's how the four we manufacture compare — and where each one wins.
The industry workhorse. Cost-effective, mechanically stable and dependable for the majority of power and LED designs.
Best value · highest volume7–8× the heat transfer of alumina with a CTE close to silicon — the default for high-power modules and laser diodes.
Best heat dissipationExceptional fracture toughness for thermal-cycling reliability — the go-to for EV traction inverters and AMB power modules.
Best reliability / EVVery high conductivity for niche RF and vacuum applications. Handled under strict controls due to dust toxicity.
Specialist · RF / vacuumHigher bars pull heat away from the die faster (W/mK).
Not sure which fits your thermal budget? Send us your power density and we'll recommend a stack-up. Ask an engineer →
From thick-film prototypes to active-metal-brazed power modules — matched to your current, feature size and reliability target.
Direct bonded copper up to 0.4 mm for high-current power modules on alumina and AlN.
Active metal brazing on Si₃N₄ for EV inverters and thermal-cycling reliability.
Direct plated copper with laser vias for fine-feature LED, sensor and RF substrates.
Sputtered Ti/Cu/Au down to ±10 µm lines for precision resistors and microwave circuits.
Screen-printed Ag/AgPd/Au conductors and resistors — cost-effective at volume.
Co-fired multilayer ceramic for hermetic packages and RF/microwave modules.
| Parameter | Alumina / AlN | DBC & AMB | Thin Film |
|---|---|---|---|
| Substrate thickness | 0.25 – 2.0 mm | 0.32 – 1.0 mm | 0.25 – 1.0 mm |
| Copper / metal thickness | — | 0.1 – 0.4 mm | 1 – 30 µm |
| Min line / space | 100 / 100 µm | 200 / 200 µm | 10 / 10 µm |
| Min laser via | 0.10 mm | — | 0.06 mm |
| Max panel size | 138 × 190 mm | 138 × 190 mm | 100 × 100 mm |
| Surface finish | ENIG · ENEPIG · Immersion Ag/Au · OSP · Sn | ||
| Layer count | 1 – 2 | Double-sided | Multilayer (LTCC 20+) |
Anywhere power density, temperature or frequency pushes FR-4 past its limits, ceramic takes over.
IGBT / SiC inverters, OBC, DC-DC
COB, UV-C curing, automotive
Antennas, filters, LTCC modules
Diode submounts, TEC, sensors
Hermetic HTCC, headers, carriers
Implantable, imaging, biocompatible
Hi-rel, wide-temp, hermetic
SMPS, motor drives, welding
Representative parts across our processes. Every product is built to your drawing.
96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and…
Aluminum nitride with 0.3 mm direct-bonded copper for IGBT / SiC power modules requiring…
Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.
Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.
High-power chip-on-board lighting substrate — a rugged ceramic alternative to metal-core PCB.
Screen-printed AgPd resistor pattern for fast, uniform, precision heating elements.
Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.
AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.
Send Gerber, drawing or a sketch. Our engineers reply with DFM feedback in 24 h.
We recommend the ceramic, metallization and finish for your thermal and cost target.
Rapid prototypes in as little as 72 h, with dimensional and electrical reports.
Qualified tooling scales with SPC, traceability and on-time delivery.
Tell us the material, size and quantity — or just attach a file. A ceramic PCB engineer replies within one business day.
A ceramic engineer replies within one business day. No obligation.
Or reach us directly · [email protected] · WhatsApp +86 136 00427328