PCBSYNC specializes in the research and development of ceramic-based circuit boards, with a leading edge over industry peers in the metallization of a wide range of substrate materials. To date, we have successfully delivered products built on:
- Alumina ceramic (Al₂O₃)
- Aluminum nitride (AlN)
- Zirconium oxide (ZrO₂)
- Lead oxide
- Silicon carbide (SiC)
- Silicon nitride (Si₃N₄)
- ZAT
- Glass
- Quartz
- Diamond
- Sapphire ceramic
DPC (Direct Plate Copper)
Direct Plate Copper is a substrate metallization process performed under high-temperature, high-vacuum conditions using evaporation and magnetron sputtering. A thin transition-metal film is first sputtered onto the substrate surface, followed by a copper layer; the board is then completed through a standard sequence of PCB processes.
Backed by a mature workflow and a stable engineering team, PCBSYNC reliably handles industry pain points such as surface interconnection (via conduction) and via fill rate. We achieve line widths and spacings down to 50 μm, with copper thicknesses ranging from 1 μm to 1000 μm, and offer fully customized service tailored to each customer’s specifications.
Multilayer Ceramic Circuit Boards
Traditional multilayer thick-film boards rely on a print-and-sinter approach: each layer is fabricated separately (punching → filling → printing), then stacked, laminated, and co-fired into a single substrate. This method is limited in the number of layers it can practically support and in the fineness of patterns it can produce.
PCBSYNC uses an advanced process that sputters a ceramic film as the dielectric layer directly onto an already-metallized ceramic circuit board, with a second patterned metal layer built on top. Compared with traditional methods, this enables finer pattern definition and is well suited to high-density routing, high-capacity designs, and high-level chip integration — yielding final products that are denser, thinner, and more precise.
Laser Print Metallization Technology
Developed by the National Optoelectronics Laboratory’s R&D team in combination with novel materials and cutting-edge processes, this technology uses laser processing and a new soldering technique to print circuit patterns directly onto a variety of substrates. It is particularly suited to components with complex geometries, enabling genuine three-dimensional circuit layouts. Samples have been completed in the laboratory, and mass-production trials are well under way.
Laser Etching
Conventional PCB patterning requires plating resist (dry film or ink) that must later be stripped away, producing pollution and material waste. Laser etching instead removes metallization directly from already-plated substrates to define the circuit pattern, eliminating both resist application and stripping. This saves process steps and material, and is particularly well suited to certain specialized products.
Laser Drilling and Cutting
Our equipment is built around top-tier international fiber lasers, with optimized optical paths that focus the laser spot to under 50 μm. Minimum drilled hole diameter reaches 0.06 mm, with a minimum board thickness of 0.1 mm. External processing services include high-precision scribing, half-cutting, and full cutting in any required shape — tailored to meet diverse customer requirements.