AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.

AlN submount with TEC-ready metallization for optoelectronic and laser-diode assemblies.

Co-fired tungsten/moly ceramic package with hermetic sealing for semiconductor and aerospace.

Active-metal-brazed silicon nitride engineered for EV traction inverters and severe thermal-cycling.

96% Al₂O₃ with laser-drilled vias and ENIG finish. Fine-feature routing for LED, sensors and…

Sputtered Ti/Cu/Au at ±10 µm line accuracy for microwave, 5G and precision resistor networks.
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