A ceramic circuit cannot be specified by picking independent minima from several process tables. The ceramic grade, conductor formation, metal thickness, feature geometry, finish and assembly route constrain each other. This guide explains those interactions; use the capability review page to prepare a specific supplier inquiry.
First identify a named ceramic grade and the intended metallization route. Direct bonded copper joins copper sheet to ceramic, while direct plated copper builds conductors using deposited metal and plating. Thick-film printing, thin-film deposition and co-fired multilayer ceramic are different manufacturing routes. Compatibility depends on the selected grade, surface preparation and joining process. Read the DBC and DPC guide for the process distinction.
Conductor thickness affects achievable edge shape, spacing, registration and thickness uniformity. Request the feature limits that apply at the intended metal thickness and inspect the critical geometry on a drawing. A nominal trace width does not define its current rating: temperature rise depends on the conductor cross-section, cooling and the rest of the circuit.
State each hole’s function, finished size and tolerance, whether metal or fill is required, and the clearance to nearby features. Define dimensions before or after singulation and any acceptance criterion for edge chips. A finish must suit the actual attach process; solderable and wire-bondable surfaces require their own compatibility and acceptance review.
Record the proposed stack, critical dimensions, test conditions, inspection method, exceptions and drawing revision. Separate a general process description from a supplier’s demonstrated production limit. Rogers’ DBC/AMB layout discussion illustrates why conductor layout and substrate geometry affect bending; its product-specific limits are not AluminaPCB specifications.
Use the design review guide to prepare the drawing and request a review of the complete specification.